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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC2533
AM TUNER FOR ELECTRONIC TUNING CAR RADIOS
The PC2533 is an IC developed as an AM tuner for car stereos and car radios. It employs an up-conversion type double super-heterodyne configuration (IF1 = 10.71 MHz, IF2 = 450 kHz). The internal configuration consists of the MIX1 block (MIX1, OSC1, Buff1), MIX2 block (MIX2, OSC2, Buff2), IF amplifier, detection circuit, AGC circuit, signal meter circuit, SD (station detector) circuit, and Lo/DX (short range/long range) circuit.
Features
* Possible to select stations using only one varactor diode with narrow variable capacitance range * Tracking adjustment unnecessary * Coil switching between LW (long wave) and MW (middle wave) unnecessary * Less sensitivity deviation due to tracking error * High S/N: 60 dB * Signal meter output with good linearity * Signal meter output voltage inclination setting possible by external resistor. * Can be used with IF (intermediate frequency) counter turning system or high/low tuning system.
SD Sensitivity Setting Type Number IF Counter Output Set by pin No. 7 High/Low Output Set by pin No. 9 Signal Meter Voltage Inclination Setting Depends on SD sensitivity setting
Remarks SD sensitivity of IF counter system and high/low system can be set independently. Tilt of the signal meter voltage can be set without regard to SD sensitivity.
PC2533GS-01
PC2533GS-02
Set by pin No. 7
Set by pin No. 9
* LO/DX function on-chip * Since IFT (intermediate frequency transformer) turn ratio is free from limitation for matching of ceramic filter impedance, it is easy to design MIX gain with IFT.
The information in this document is subject to change without notice. Document No. S11989EJ4V0DS00 (4th edition) Date Published August 1998 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1993
PC2533
Ordering Information
Part Number Package 36-pin plastic shrink SOP (300 mil) 36-pin plastic shrink SOP (300 mil)
PC2533GS-01 PC2533GS-02
Block Diagram
RF AGC T.C. IF AGC T.C.
20 IF AGC 17
Buff1OUT
Buff2OUT
MIX1OUT
MIX1OUT
MIX2OUT
MIX2OUT
MIX1BYP
MIX2BYP
RF AGC1
RF AGC2
Buff1IN
Buff2IN
MIX1IN
MIX2IN
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
19
RF AGC driver
MIX 1
Buff 1
MIX 2
Buff 2
RF AGC detector
MIX 2 AGC
IF amplifier
AGC comparator LO/DX
Time constant selector switch Signal meter
OSC Buff 1
OSC 1
SEEK 4 5 6 7
Station detector 8 9 10 11
OSC 2
Detector
2
3
12
13
14
15
16
18
SD ACadj [SDadj]
SD DCadj [SMOUT]
OSC1 Buff
MIX2AGC T.C.
SD ACOUT
SD DCOUT
OSC2 (B)
OSC2 (E)
SD IFIN
VO (AF)
GND
Remarks 1. Bold lines indicate flow of audio signal. 2. PC2533GS-02 pin names are in parentheses. Pins not in parentheses are used in both the
PC2533GS-01 and PC2533GS-02.
2
IF2OUT
ALC
Vref1
LO/DX
SEEK
Vref2
VCC
IF2IN
GND
PC2533
Pin Configuration (Top View)
36-pin plastic shrink SOP (300 mil) * PC2533GS-01 * PC2533GS-02
OSC1 Buff ALC Vref1 LO/DX SEEK SD ACOUT SD ACadj [SDadj] SD IFIN SD DCadj [SMOUT] SD DCOUT OSC2 (B) OSC2 (E) Vref2 MIX2AGC T.C.
1 2 3 4 5 6 7 8 9 10 11 12 13 14
36 RF AGC1 35 RF AGC2 34 RF AGC T.C. 33 MIX1IN 32 MIX1OUT 31 MIX1OUT 30 MIX1BYP 29 Buff1IN 28 GND 27 Buff1OUT 26 MIX2BYP 25 MIX2OUT 24 MIX2OUT 23 MIX2IN 22 Buff2IN 21 Buff2OUT 20 IF AGC T.C. 19 IF2IN
VO (AF) 15 GND 16
VCC 17 IF2OUT 18
Remark PC2533GS-02 pin names are in parentheses.
Pins not in parentheses are used in both the
PC2533GS-01 and PC2533GS-02.
3
PC2533
1. Pin Description
Names and symbols in parentheses indicate pin names for PC2533GS-02. parentheses are pin names used in both the PC2533GS-01 and PC2533GS-02. (1/7)
Pin No. 1 Symbol OSC1 Buff Name OSC1 Buff output Equivalent Circuit
Names and symbols not in
VCC
ZO = 30 20 % 1
2
ALC
OSC1 ALC
VCC
2
3 4
Vref1 LO/DX
Reference voltage LO/DX control
Reference voltage (5.3 V)
VCC
4
5
SEEK
Seek request
Vref
5 k 5 60 k
4
PC2533
(2/7)
Pin No. 6 Symbol SD ACOUT SD AC output Name Equivalent Circuit
RO = 20.5 k 20 % 500 6 20 k
7
SD ACadj
SD AC sensitivity setting (and signal meter ouput)
( PC2533GS-01) VCC
5 k
7
[SDadj]
[SD AC sensitivity and SD DC sensitivity setting]
( PC2533GS-02) VCC
5.2 V 5 k
7
8
SD IFIN
SD IF input Vref 60 k
500
8
5
PC2533
(3/7)
Pin No. 9 Symbol SD DCadj Name SD DC sensitivity setting (and signal meter output) Equivalent Circuit
( PC2533GS-01) VCC
5 k
9
[SMOUT] [Signal meter output]
( PC2533GS-02)
VCC
5.2 V 5 k
9
10
SD DCOUT
SD DC output (Active high) 10
11 12
OSC2 (B) OSC2 (E)
OSC2 (base) OSC2 (emitter)
ZIN = 5 k 20 % 11 Vref VCC
ZO = 240 20 % 12
13
Vref2
Reference voltage
Reference voltage (6.0 V)
6
PC2533
(4/7)
Pin No. 14 Symbol MIX2AGC T.C. Name MIX2 AGC smoothing Equivalent Circuit
14 RT Vref
RT = 1 k 20 %
15
VO(AF)
Audio output
VCC
ZO = 300 20 % 15
20 16 17 18 GND VCC IF2OUT Ground Power supply voltage IF amplifier output 18 GND (low frequency) VCC
19
IF2IN
IF amplifier input
19
20
IF AGC T.C.
IF AGC input VCC
15 RT
20 RT = 100 k 20 %
7
PC2533
(5/7)
Pin No. 21 Symbol Buff2OUT Name 2nd IF burffer output
ZO = 2 k 20 % 21
Equivalent Circuit
22
Buff2IN
2nd IF buffer input
Vref
22 ZIN = 30 k 20 % 23 MIX2IN MIX2 input
23
26 ZIN = 330 20 %
24 25
MIX2OUT MIX2OUT
MIX2 output MIX2 output
25
24
26
MIX2BYP
MIX2 bypass
23
26 ZIN = 330 20 %
27
Buff1OUT
1st IF buffer output
27 ZO = 330 20 %
8
PC2533
(6/7)
Pin No. 28 29 Symbol GND Buff1IN Ground 1st IF buffer input Vref Name Equivalent Circuit GND (high frequency)
29 ZIN = 15 k 20 % 30 MIX1BYP MIX1 bypass
33
30 ZIN = 1.2 k 20 %
31 32
MIX1OUT MIX1OUT
MIX1 output MIX1 output
31
32
Vref
33
MIX1IN
MIX1 input
33
30
ZIN = 1.2 k 20 %
34
RF AGC T.C.
RF AGC smoothing
34 ZO = 12 k 20 %
9
PC2533
(7/7)
Pin No. 35 Symbol RF AGC2 Name RF AGC output (cascade base) Equivalent Circuit
Vref
ZO = 11 k 20 % 35
36
RF AGC1
RF AGC output (PIN diode)
36 ZO = 22 k 20 %
10
PC2533
2. Operation of Each Block
2.1 FR Amplifier Circuit Block Fig. 2-1 RF Ampliier Circuit
VCC R1 C8 L3 R2 L4 LPF L5 C6 33 MIX1 Q1 + L1 Q2 C9 C3 C4 C5 C7 35 L2 C1 C2 36 34 + 4 RF AGC LO/DXNote 30 From MIX2
Note LO : 3 V or higher DX : 1 V or lower In the AM band, the capacitance of a car radio antenna depends on its length, diameter, cable length, etc. Therefore, J-FET is used in the PC2533 to raise RF input impedance. Since the PC2533 raises the first IF (intermediate frequency) to 10.71 MHz, there is no need for a tuning circuit between the RF amplifier circuit and MIX1. Instead, it employs an LPF (about 6 MHz) consisting of L4, L5 and C3 to C5 between the RF amplifier circuit and MIX1 in order to cut image frequency (21.4 MHz or higher). Because this allows a wide-band RF amplifier circuit to be configured without using a tuning circuit, frequency sensitivity deviation can be minimized to a high degree. The AGC circuit consists of RF AGC1 by the PIN diode connected to the FET gate and RF AGC2 by the cascade transistor Q1. Use a low-noise transistor even with low current for the cascade transistor Q1 (if a high-noise one is used, the S/N ratio deteriorates). Remark Set bias voltage for cascade transistor Q1 to VC > VB.
11
PC2533
2.2 MIX1 Block Fig. 2-2 MIX1 Block
T1 VT + VCC To 10.7 MHz BPF
2
3
31 Q101 Q102
32 Q104 Q103
17
29 R112 Buff1
27
Bias circuit
R11
OSC1 Q105 Q108 R109 R110 R107 R108
Note R111
Q109 1
Q106 Q107
28 From LPF 33 30 To RF AGC circuit (Fig. 2-4)
Note Output impedance and input impedance of Buff1 are 330 and 15 k, respectively. MIX1 (Q101 to Q108) is a DBM (double balanced mixer). MIX1 output is supplied to 10.7 MHz ceramic filter via Buff1 (output impedance: 330 ) for impedance matching. The local oscillation signal is applied to the bases of Q101 to Q104, and the RF signal to the base of Q105. MIX1 (Q101 to 108) multiplies the local oscillation signal by RF signal, and converts to the resonance frequency of IFT T1 for output. The local oscillation signal is output from pin 1 via Q109 (OSC Buff). It has an amplitude of 110 dBV and can be directly input to CMOS LSI for use by the PLL synthesizer. The RF signal applied to the base of Q105 is also input to the detector of the RF AGC circuit.
12
PC2533
2.3 MIX2 Block Fig. 2-3 MIX2 Block
VCC From 10.7 MHz BPF Note + Xtal To IF amplifier
28 R211
23
17
24
25 R212
14
13
12
11
22
21
Current control circuit
Buff2 Note Q204 Q203
Q201 Q202 Bias circuit R210 Q205 Q206 R209 R207 To RF AGC circuit (Fig. 2-4)
Q203 OSC2 Q207 Q208
R208
From IF AGC (Fig. 2-6)
Note Output impedance and input impedance of Buff2 are 2 k and 30 k, respectively. MIX2 (Q201 to Q208) is a DBM with a configuration similar to that of MIX1. The major difference from the MIX1 is that MIX2 is equipped with a current control circuit for output and is controlled by the AGC. Input impedance of MIX2 is 330 to match the 10.7 MHz ceramic filter. Output impedance of Buff2 is 2 k to match the 450 kHz ceramic filter. IF signal input from pin 23 is also input to the detector of the RF AGC. The RF AGC is detected by both MIX1 and MIX2 blocks. The Buff1 and Buff2 ensure impedance matching between MIX1 and MIX2 outputs and each ceramic filter. As a result, IFT design is not restricted by the need to match ceramic filter impedance. For turn ratio, etc., only conversion gain need be taken input account, so it is easy to design.
13
PC2533
2.4 RF AGC Block Fig. 2-4 RF AGC Block
R412
R403
Q407
Q408
Bias circuit
Q401 R405 Q405 AMP. + - AMP.
Q402 Q403
Time constant switchover Q404 Q406 D401 R406
R409
Detection and addition circuit
From MIX2 (Fig. 2-3)
+ -
From MIX1 (Fig. 2-2)
R402
R404
R410 R408 34 +
36 To RF amplifier circuit (Fig. 2-1)
35
The configuration of the RF AGC is shown in Fig. 2-4. After being detected by the RF AGC detector and added, the input signal from MIX1 and MIX2 is smoothed by external capacitor of pin 34, and its DC voltage controls the RF AGC. RF AGC output controls the PIN diode from pin 36 and controls base voltage of cascade transistor which determines FET VDS from pin 35. In addition, by detecting sudden fluctuation of pin 34 voltage and switching over time constants, RF AGC response convergence when the electric field suddenly changes is improved. Operation start time of the RF AGC can be delayed slightly by connecting a resistor parallel to the external capacitor of pin 34.
14
PC2533
2.5 IF Amplifier Block and Detection Block Fig. 2-5 IF Amplifier and Detection Block
R19 From 450kHz BPF + C19 T3
To SD circuit
19
18 17
VCC
IF amp
Bias circuit
-
Q301 R301 R302 Q302 15 Audio output
+
R303
R304
From IF AGC circuit (Fig. 2-6)
To IF AGC circuit (Fig. 2-6)
In the IF amplifier block, DC feedback is carried to pin 19 via an external low pass filter (composed of T3 and C19) from pin 18, an output pin. The DC electric potential of pin 18 is designed to be fixed approximately equal to the (+) side input of the IF amplifier. The value of R19 is the input impedance, so impedance matching to 450 kHz ceramic filter is possible. The output signal current of the IF amplifier is converted to signal voltage by being resonated by T3 and input to the detection circuit after frequency selection. Emitter follower detection by Q302 is adopted for the detection circuit block.
15
PC2533
2.6 IF AGC Block
Fig. 2-6 IF AGC Block (for PC2533GS-01)
From detection circuit (Fig. 2-5)
To MIX2 (Fig. 2-3) VCC
To IF amp. (Fig. 2-5)
Signal meter circuit Q503 D501 Q504
Time constant switchover
Bias circuit
Q501 Note
Q502
D502
Note In the case of PC2533GS-02, the part enclosed by the dotted line is illustrated as shown below.
R501 R502 5 k 5 k
Voltage limiter R501 R502 5 k 5 k
To SD circuit (Fig. 2-7) From SD circuit (Fig. 2-7) 7 9 20 +
IF AGC block configuration is shown in Fig. 2-6. The signal detected from pin 15 is smoothed by the capacitor of pin 20, and its DC voltage controls the IF AGC. The IF AGC controls the IF amplifier and MIX2. In the operation sequence, it first controls the gain of the IF amplifier, then controls the gain of MIX2. The signal meter circuit output (current output) is in proportion to the DC voltage smoothed by pin 20, and converted to voltage by the external resistor of pin 7 or 9. Therefore, output voltage value and gain can be set by the value of the external resistor.
Note
Note For relation between the external resistor and the signal meter, refer to Signal meter output voltage (adjustment by resistor between pin 9 and GND) in section 4. Characteristic Curves.
16
PC2533
2.7 Station Detector Circuit Block Fig. 2-7 Station Detector Circuit Block
ON/OFF + 1.0 V
Bias circuit
Detection comparator 1
-
Bias circuit
+ -
Detection comparator 2
1.0 V
- +
From signal meter circuit (Fig. 2-6)
To time constant switchover circuit (Fig. 2-6)
10
5 From DTS (request)
6
8
SD output (Active high)
SD AC output
450kHz IF input (from T3)
The configration station detector (SD) circuit block is shown in Fig. 2-7. The SD circuit stops scanning or seeking when a broadcast wave is received when auto scanning or seek tuning. Since the PC2533 has two outputs (DC high/low signal (open collector) and AC IF signal (f = 450 kHz)), it can be used according to DTS (digital tuning system) type. Input the SD request signal from DTS to pin 5. The SD sensitivity setting methods of the PC2533GS-01 and PC2533GS-02 differ. With the PC2533GS-01, SD sensitivities in the IF counter output system and in the high/low output system are set by external resistor between pin 7 and GND and by external resistor between pin 9 and GND. With the PC2533GS-02, SD sensitivities in both the IF counter output system and high/low output system are set by external resistor between pin 7 and GND (refer to Fig. 2-6). Table 2-1 SD Sensitivity Setting Examples
Value of Resistor between Pin 9 or Pin 7 and GND 51 k 24 k 10 k SD Sensitivity (AC, DC) 27 dBV 29 dBV 33 dBV
17
PC2533
The reference voltage of the PC2533-01 and PC2533-02 detection comparator has been internally fixed at 1.0 V. Under the influence of R501 (5 k) and R502 (5 k) of the siganl meter circuit (Fig. 2-6), signal meter output voltage and detection comparator input voltage do not perfectly coincide. For SD sensitivity setting, refer to the following formula. Detection comparator input voltage = Signal meter output voltage x (1 + R501 Value of resistor between pin 7 and GND )
Remark Because DC output is open-collector type (Active high), connect pull-up resistor to pin 10 to use.
18
PC2533
3. Electical Characteristics
Absolute Maximum Ratings (TA = 25 C)
Item Power supply voltage Power dissipation Operating ambient temperature Storage temperature Symbol VCC PD TA Tstg Rating 10 600 -40 to +85 -55 to +125 Unit V mW C C
Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. Recommended Operating Conditions (TA = 25 C)
Item Power supply voltage Input voltage Symbol VCC VIN Conditions MIN. 7.5 TYP. 8.0 MAX. 8.5 132 Unit V dBV
Electrical Characteristics (Unless specified, TA = 25 C, VCC = 8 V, fIN = 999 kHz, fMOD = 400 Hz, AMMOD = 30 %, RSD1 (resistor between pin 7 and GND) = RSD2 (resistor between pin 9 and GND) = 24 k, 15-pin measurement load = 100 k)
Item Circuit current Detection output Signal-to-noise ratio Total harmonic distortion 1 Total harmonic distortion 2 Total harmonic distortion 3 Signal meter output voltage 1 Signal meter output voltage 2 Signal meter output voltage 3
Note
Symbol ICC VO S/N THD1 THD2 THD3 VS1 VS2 VS3
Conditions No input (excluding FET) VIN = 74 dBV VIN = 74 dBV VIN = 74 dBV VIN = 74 dBV, AMMOD = 80 % VIN = 130 dBV, AMMOD = 80 % No input VIN = 30 dBV VIN = 74 dBV
MIN. - 150 53 - - - - 0.5 4.8 (4.3) 106
TYP. 45 180 60 0.3 0.7 0.7 0 1.5 5.5 (5.0) 110
MAX. 55 210 - 1.0 1.0 1.5 0.2 2.5 6.7 (5.5) 114
Unit mA mVrms dB % % % V V V
Local buffer output 1
VOSC
1-pin load: 20 pF or less
dBV
Note Specifications in parentheses for signal meter output voltage 3 are for PC2533GS-02. Values of other items are the same for PC2533GS-01 and PC2533GS-02.
19
PC2533
Reference Characteristics
Item Maximum sensitivity Symbol MS Conditions VIN making VO -10 dB, where VO = 0 dB at VIN = 74 dBV VIN making SEEK, SD AC OUT level 101 dBV or more VIN making SEEK, SD AC OUT voltage 4.8 V or more Delay time from the time when changing SEEK VIN = 0 40 dBV to the time when pin 10 voltage becomes 4.8 V or more VIN = 60 100 dBV, VO = 3 dB VIN = 74 dBV, 2IF Maximum value of a series resistor with which the crystal can oscillate VIN making S/N = 20 dB MIN. - TYP. 13 MAX. - Unit dBV
S/D sensitivity (AC)
SS(AC)
-
29
-
dBV
S/D sensitivity (DC)
SS(DC)
-
29
-
dBV
S/D output time
T-SD
0
5
25
ms
Vo stabilization time
T-VO
60
160
260
ms
Tweet 2nd local buffer negative impedance
TW ZOSC2
- 400
60 -
- -
dB
Usable sensitivity
US
-
25
-
dBV
20
PC2533
4. Characteristic Curves
Input/Output Characteristics (1)
Total harmonic distortion THD (%), Signal meter voltage (V)
MS (VO = 0 -10 dB)
Total harmonic level VO (dB), Noise (dB)
VO VCC =8 V fIN = 999 kHz fMOD = 400 Hz AMMOD = 30 % RSD1 = RSD2 = 24 k
7 6 5 4 3 2 1 0
-10 US (at S/N=20 dB) -20 -30 -40 -50 Noise -60 THD 30 % -70 THD 80 % 0 10 20 30 40 50 MS = 14 dB V US = 25 dB V 60 70 80 90 ( PC2533GS-01) Signal meter voltage ( PC2533GS-02)
100
110
120
130
Signal input level (dB V)
Input/Output Characteristics (2)
Total harmonic distortion THD (%), Signal meter voltage (V)
0
Detection output level VO (dB), Noise (dB)
VO MS (VO = -10 dB) US (at S/N=20 dB) ( PC2533GS-01) Signal meter voltage ( PC2533GS-02) VCC = 8 V fIN = 216 kHz fMOD = 400 Hz AMMOD = 30 % RSD1 = RSD2 = 24 k
7 6 5 4 3 2 1 0
-10 -20 -30 -40 -50 -60
Noise THD 30 %
-70
THD 80 % 0 10 20 30 40 50 MS = 12.5 dB V US = 28 dB V
60
70
80
90
100
110
120
130
Signal input level (dB V)
21
PC2533
Input/Output Characteristics (3) (FET Load: 255 ) (Reference Only)
VO
0
Detection output level VO (dB), Noise (dB)
-10 -20 -30 -40 Noise -50 -60 -70 0 10 20 30 40 50 60 70 80 Signal input level (dB V) 90 100 110 120 130 VCC = 8 V fIN = 999 kHz fMOD = 400 Hz AMMOD = 30 % RSD1 = RSD2 = 24 k
Input/Output Characteristics (4)
VO VO -10 -20 -30 -40 -50 -60 -70 29 dB VCC = 8 V fIN = 999 kHz fMOD = 400 Hz AMMOD = 30 % RSD1 = RSD2 = 24 k
Detection output level VO (dB), Noise VN (dB)
0
LO/DX low LO/DX high
VN
VN 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Signal input level (dB V)
22
PC2533
Cross-Modulation Characteristics (40 kHz Detuning)
0 -10 -20 -30 -40 -50 -60 40 dB V VCC = 8 V Desired: f = 999 kHz Interference: f = 1039 kHz Desired: V = 40 dBV 45 dB V 60 dB V 80 dB V 45 dB V
Desired: V = 100 dB V 80 dBV 60 dB V
Detection output level VO (dB)
100 dBV
Desired: 400 Hz 30% modulation; interference: non-modulation Desired: non-modulation; interference: 400 Hz 30% modulation Desired: non-modulation; interference: non-modulation
50
60
70
80
90
100
110
120
130
140
Interference signal input level (dBV)
Cross-Modulation Characteristics (40 kHz Detuning, FET Load 255 ) (Reference Only)
Desired: V = 100 dB V 80 dB V 40 dBV 45 dBV 60 dBV VCC = 8 V Desired: f = 999 kHz Interference: f = 1039 kHz
0 -10 -20 -30 -40 -50 -60
Detection output level VO (dB)
Desired: V = 40 dBV 45 dB V 65 dB V 80 dB V
100 dBV
Desired: 400 Hz 30% modulation; interference: non-modulation Desired: non-modulation; interference: 400 Hz 30% modulation Desired: non-modulation; interference: non-modulation
0 50
60
70
80
90
100
110
120
130
140
Interference signal input level (dBV)
23
PC2533
Cross-Modulation Characteristics (400 kHz Detuning)
Desired: V = 100 dB V 80 dB V 40 dB V 60 dBV
0 -10 -20 -30 -40 -50 -60 60 dB V 80 dB V Desired: V = 40 dBV VCC = 8 V Desired: f = 999 kHz Interference: f = 1399 kHz
Detection output level VO (dB)
100 dBV
Desired: 400 Hz 30% modulation; interference: non-modulation Desired: non-modulation; interference: 400 Hz 30% modulation Desired: non-modulation; interference: non-modulation
50
60
70
80
90
100
110
120
130 140
Interference signal input level (dBV)
Power Supply Voltage Characteristics
Detection output level VO (dB), signal-to-noise ratio S/N (dB)
0 Recommended operating range -10
VO
Maximum sensitivity MS (dB V), usable sensitivity US (dB V), S/D sensitivity SS (dB V)
VS3 -20 -30 -40 -50 VS2 -60 S/N 1 MS THD 80 % THD 30 % SS 5 4 3 US 2
50
40
30
20
10 0
6
7
8
9
10
Power supply voltage (V)
24
Total harmonic distortion THD (%), Signal meter output voltage 2 VS2 (V) Signal meter output voltage 3 VS3 (V)
6
PC2533
Modulation Factor Characteristics
600 VCC = 8 V fIN = 999 kHz
Detection output level VO (mVrms)
500 VO 400
Total harmonic distortion THD (%)
3
300
2
200
1
100 THD
0
0
20
40
60
80
100
Modulation factor (%)
Detuning Frequency Characteristics (Maximum Sensitivity), Signal Selectivity Characteristics
90 80 70
Signal input level (dBV)
60 50 40 30 20 10 -15 -10 -5 0 5 10 15
Detuning frequency (kHz)
25
PC2533
Modulation Frequency Characteristics
0 VO Detection output level (dB) -10 VCC = 8 V -20 -30 -40 -50 1 -60 0 10 50 100 500 1k 5k 10k THD
Total harmonic distortion THD (%)
5 4 3 2
Modulation frequency (Hz)
Signal Meter Output Voltage (Adjustment by Resistor between Pin 9 and GND)
7 6
Signal meter output voltage (V)
51 k 36 k
5 4 3
VCC = 8 V fIN = 999 kHz AMMOD = 30 % fMOD = 400 Hz
24 k (51 k) (24 k) 20 k
12 k
2 1
6.2 k (6.2 k) 1 k (1 k)
0
10
20
30
40 50 60 70 Signal input level (dBV)
80
90
100
Remark Figures in parentheses indicate setting value (resistor between pin 9 and GND) for PC2533GS-02. A circuit that restricts output current from pin 9 is mounted on PC2533GS-02.
26
PC2533
Receiving Frequency Characteristics
0 (LW band) -10 50
Maximum sensitivity MS (dB V), usable sensitivity US (dB V) Detection output level VO (dB), signal-to-noise ratio S/N (dB)
(MW band)
VO
-20 -30 -40 -50 (LW band) -60 (LW band) -70 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Receiving frequency (MHz) (MW band) (MW band) S/N MS (LW band) (MW band) US
40 30 20 10 0
Temperature Characteristics (Signal Meter Voltage vs. Operating Ambient Temperature)
10 9
Signal meter output voltage 2 VS2 (V), signal meter output voltage 3 VS3 (V)
8 7 6 5 4 3 2 1 0 -40 -20 0 20 40 60 80 100 VS2 VS3
Operating ambient temperature TA (C)
27
PC2533
Temperature Characteristics (Maximum Sensitivity, Usable sensitivity vs. Operating Ambient Temperature)
50
Maximum sensitivity, Usable sensitivity (dBV)
40
30 Usable sensitivity 20 Maximum sensitivity 10
0
-40
-20
0
20
40
60
80
100
Operating ambient temperature TA (C)
Temperature Characteristics (Detection Output Level, Signal-to-Noise Ratio vs. Operating Ambient Temperatue)
200 180
Detection output level VO (mVrms)
0 -10 -20 -30 -40 -50 -60 -70 -80
Signal-to-noise ratio S/N (dB)
160 140 120 100 80 60 40
VO
S/N
-40
-20
0
20
40
60
80
100
Operating ambient temperature TA (C)
28
PC2533
Temperature Characteristics (THD vs. Operating Ambient Temperatue)
5
Total harmonic distortion THD (%)
4 Input: 74 dBV Modulation factor: 30 % Input: 74 dBV Modulation factor: 80 % Input: 130 dBV Modulation factor: 80 %
3
2
1
THD1
THD2
THD3
0
-40
-20
0
20
40
60
80
100
Operating ambient temperature TA (C)
29
PC2533
510
0.047 F
12 H 47 pF 150 pF 2SC1844 + 47 F 0.022 F
L3
12 H 100 pF
22
0.047 F
SFE10.7MHY-A
CFWS450HT
T1 0.022 F 10 F 0.022 F 50
32 31 30 29
T2 0.022 F 50
27 26 25 24 23
2 k 4.7 F 0.022 F
22 21
2.2 F +
0.022 F
3300 pF
36 35
+
34
+
20 19
33
28
2SK1000
RF AGC driver
MIX1
Buff1
MIX2
Buff2
L2 L1 Dummy antenna RF AGC detection MIX2 AGC IF amplifier
65 pF 30
15 pF LO/DX
AGC comparator
Signal meter
Time constant selector switch IF AGC
SG IN 0.01 F OSC1 Buff OUT
OSC Buff
OSC1
SEEK
Station detector
OSC2
Detector
5. Measurement Circuit
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
LO/DX (LO: 3 V or higher; DX: 1 V or lower)
330 pF VTUNE 100 k 47 pF
SEEK (ON: 1.5 V or higher; OFF: 0.3 V or lower)
L4 1 F
+
39 pF RSD1
0.01 F SDIN RSD2 51 k 5V SD ACadj [SDadj] SD DC OUT SD DCadj [SMOUT]
15 pF 47 pF
+ 10 F 2.7 k 0.047 F
0.01 F
(4)
(2) (1)
0.01 F SD AC OUT
10.26 MHz
+ 47 F 0.033 F T3
KV1310 (TOKO, Inc.)
AUDIO OUT (6) VCC (3)
Remark Pin names in parentheses are those of PC2533GS-02.
30
PC2533
Coil Specifications (TOKO, Inc.)
Product No. L1
(3) (2) (1) (6) (4)
Connection Diagram
Prototype No. X119FNS-16314Z
Specifications (1) - (3) 15T L = 4.7 H Qu > 60
L2
(3) (2) (1) (6) (4)
388DN-1043BS
(4) - (6) 1440T L = 100 mH Qu > 45
L3
(3) (2) (1) (6) (4)
247BR-0147Z
(1) - (3) 274T L = 2 mH Qu > 50
L4
392AN - 1871Y
(3) (2) (1)
T1
(4)
(1) - (3) 8T
(1) - (2) 4T
(2) - (3) 4T
(6)
392AC-1883N
L = 1.8 H Qu > 70
(3) (2) (1)
T2
(4)
(1) - (3) 14T
(1) - (2) 7T
(6)
7PSYC-1779N
C = 43 pF Qu > 50 fO = 10.7 MHz (1) - (3) 152T (1) - (2) 76T
(2) - (3) 7T (4) - (6) 3T
(3) (2) (1)
T3
(4)
(6)
CX7YCS-8986N
C = 180 pF Qu > 25 fO = 450 kHz (1) - (3) 148T (1) - (2) 43T
(2) - (3) 76T (4) - (6) 40T
(3) (2) (1)
(4)
(6)
C = 180 pF Qu > 40 20 % fO = 450 kHz
(2) - (3) 105T (4) - (6) 30T
* BPF SFE10.7 MHY-A (MURATA mfg. Co., Ltd.) CFWS450HT (MURATA mfg. Co., Ltd.) * RF FET 2SK1000 (NEC)
31
PC2533
6. Package Drawing
36 PIN PLASTIC SSOP (300 mil)
36 19 detail of lead end
R 1 A 18
H F G S C D E M
M
I
J
B K
L N S
NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
ITEM A B C D E F G H I J K L M N R
MILLIMETERS 15.30.24 0.97 MAX. 0.8 (T.P.) 0.37 +0.08 -0.07 0.1250.075 1.675+0.125 -0.175 1.55 7.70.3 5.60.15 1.050.2 0.22 +0.08 -0.07 0.60.2 0.10 0.10 55 P36GM-80-300B-4
32
PC2533
7. Recommended Soldering Conditions
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Surface mount device
PC2533GS-01, 2533GS-02: 36-pin plastic shrink SOP (300 mil)
Process Infrared ray reflow Conditions Peak temperature: 235 C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 2 times. VPS Peak temperature: 215 C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 C or higher), Maximum number of reflow processes: 2 times. Wave soldering Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). Partial heating method Pin temperature: 300 C or below, Heat time: 3 seconds or less (Per each side of the device). - WS60-00-1 VP15-00-2 Symbol IR35-00-2
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress.
33
PC2533
[MEMO]
34
PC2533
[MEMO]
35
PC2533
[MEMO]
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96.5
34

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